Gigabyte High Density Server H263-S67-AAW1
Warranty
2 Years
All Product
20% Discount.
On Time
Free Delivery
Check serviceability
at your Pincode
Accelerating Artificial Intelligence and Leading Efficiency Engineering richer features in a revolutionary platform, Intel has made an incredible jump in processor performance in the business transformation journey.
AI and deep learning performance will benefit from the built-in AI acceleration engines, while networking, storage, and analytics leverage other specialized accelerators in the 4th & 5th Gen Intel Xeon Scalable processors.
Adding a host of new features to target a wide range of workloads, the new families of Intel Xeon processors will deliver even better CPU performance and performance per watt, and do so on a PCIe 5.0 platform with 2x the prior gen throughput to greatly speed up data movement to and from GPUs and storage.
Intel also created the Intel Xeon CPU Max Series with High Bandwidth Memory (HBM) for improvements in memory bound HPC and AI workloads.
For this new platform, GIGABYTE has products ready to get the most out of Intel Xeon CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory. Redefine Performance with 4th/5th Gen Intel Xeon Scalable Processors and Intel Xeon CPU Max Series
AI and deep learning performance will benefit from the built-in AI acceleration engines, while networking, storage, and analytics leverage other specialized accelerators in the 4th & 5th Gen Intel Xeon Scalable processors.
Adding a host of new features to target a wide range of workloads, the new families of Intel Xeon processors will deliver even better CPU performance and performance per watt, and do so on a PCIe 5.0 platform with 2x the prior gen throughput to greatly speed up data movement to and from GPUs and storage.
Intel also created the Intel Xeon CPU Max Series with High Bandwidth Memory (HBM) for improvements in memory bound HPC and AI workloads.
For this new platform, GIGABYTE has products ready to get the most out of Intel Xeon CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory. Redefine Performance with 4th/5th Gen Intel Xeon Scalable Processors and Intel Xeon CPU Max Series
Dimensions (WxHxD, mm)
Expansion Slots
Power Supply
2U 4-Node – Rear access
Per node:
Dual 3000W 80 PLUS Titanium redundant power supply
440 x 87.5 x 840
Riser Card CRSH01U:
Available for 2+1 redundant power supply configuration (optional)
Motherboard
– 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
MS63-HD1
AC Input:
CPU
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
– 100-127V~/ 16A, 50/60Hz
5th Generation Intel® Xeon® Scalable Processors
Supports NCSI function
– 200-207V~/ 16A, 50/60Hz
4th Generation Intel® Xeon® Scalable Processors
– 208-240V~/ 16A, 50/60Hz
Dual processor per node, TDP up to 270W
Optional 1 x M.2 slot (CMTP061):
– M-key
DC Input: (Only for China)
Supports TDP up to 350W with no support on OCP slot at ambient 35°C.
– PCIe Gen4 x4, from CPU_1
– 240Vdc/ 16A
– Supports 2280/22110 cards
Supports TDP up to 350W at ambient 30°C.
DC Output:
Total:
– Max 1200W/ 100-127V~
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Riser Card CRSH01U x 4:
#ERROR!
Socket
– 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
#ERROR!
Per Node:
– Max 2600W/ 200-207V~
2 x LGA 4677
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
#ERROR!
Support NCSI function
#ERROR!
Total:
– Max 3000W/ 208-240V~ or 240Vdc Input
8 x LGA 4677
Optional 4 x M.2 slots (CMTP061):
#ERROR!
– M-key
#ERROR!
Socket E
– PCIe Gen4 x4, from CPU_1
Chipset
– Support 2280/22110 cards
Note: The system power supply requires C19 power cord.
Intel® C741
Internal I/O
System Management
Memory
Per node:
Aspeed® AST2600 management controller
Per node:
1 x TPM header
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
16 x DIMM slots
1 x VROC connector
Front I/O
Dashboard
Total:
Per node:
HTML5 KVM
64 x DIMM slots
1 x Power button with LED
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
1 x ID button with LED
Sensor Reading History Data
DDR5 memory supported only
1 x Reset button
FRU Information
8-Channel memory architecture
1 x System status LED
SEL Log in Linear Storage / Circular Storage Policy
RDIMM up to 96GB supported
Hardware Inventory
3DS RDIMM up to 256GB supported
Total:
Fan Profile
4 x Power buttons with LED
System Firewall
5th Gen Intel® Xeon®: Up to 5600 MT/s
4 x ID buttons with LED
Power Consumption
4th Gen Intel® Xeon®: Up to 4800 MT/s
4 x Reset buttons
Power Control
Intel® Xeon® Max Series: Up to 4800 MT/s
4 x System status LEDs
Advanced power capping
LAN
*1 x CMC status LED
LDAP / AD / RADIUS Support
Per node:
*1 x CMC reset button
Backup & Restore Configuration
1 x 10/100/1000 Mbps Management LAN
Remote BIOS/BMC/CPLD Update
*Only one CMC status LED and reset button per system.
Event Log Filter
Total:
Rear I/O
User Management
4 x 10/100/1000 Mbps Management LAN
Per node:
Media Redirection Settings
*1 x CMC port
2 x USB 3.2 Gen1
PAM Order Settings
1 x VGA
SSL Settings
*Please refer to optional parts for ring topology support.
1 x MLAN
SMTP Settings
1 x ID button with LED
OS Compatibility
Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Please refer to OS compatibility table in support page
Video
Total:
System Fans
Integrated in Aspeed® AST2600
8 x USB 3.2 Gen1
4 x 80x80x80mm (16,500rpm)
2D Video Graphic Adapter with PCIe bus interface
4 x VGA
Operating Properties
1920×1200@60Hz 32bpp
4 x MLAN
Operating temperature: 10°C to 35°C
4 x ID buttons with LED
Operating humidity: 8-80% (non-condensing)
Management chip on CMC board:
*1 x CMC port
Non-operating temperature: -40°C to 60°C
Integrated in Aspeed® AST2520A2-GP
Non-operating humidity: 20%-95% (non-condensing)
Storage
*Only one CMC port per system.
Packaging Dimensions
Per node:
Backplane Board
1180 x 779 x 300 mm
2 x 2.5? Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1
Speed and bandwidth:
Packaging Content
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
1 x H263-S67-AAW1
Total:
TPM
8 x CPU heatsinks
8 x 2.5? Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1
1 x TPM header with SPI interface
24 x Carriers
– Optional TPM2.0 kit: CTM010
1 x 3-Section Rail kit
SAS card is required for SAS devices support
Part Numbers
SAS
– Barebone package: 6NH263S67DR000ABW1*
Depends on SAS add-in cards
– Motherboard: 9MS63HD1UR-000
RAID
– 3-Section Rail kit: 25HB2-A66125-K0R
Intel® SATA RAID 0/1/10/5
– CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R
– Front panel board – CFPH004: 9CFPH004NR-00
– Backplane board – CBPH081: 9CBPH081NR-00
– Fan module: 25ST2-888020-S1R
– Riser card – CRSH01U: 9CRSH01UNR-00
– LAN board – CLBH010: 9CLBH010NR-00
– Power supply: 25EP0-230009-L0S
Optional parts:
– C19 power cord 125V/15A (US): 25CP1-018000-Q0R
– C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
– C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
– M.2 riser card – CMTP061: 9CMTP061NR-00
– Ring topology kit (10-kit package): 6NH263S62S1000AAN11
– RMA packaging: 6NH263S67SR-RMA-A100
