Lenovo ThinkSystem HGX H100 SR675 V3 Server
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Lenovo ThinkSystem SR675 V3 Server - System Overview
This machine can support up to 8x double-wide GPUs including the new NVIDIA H100 and L40 Tensor Core GPUs, or up to 4x SXM5 NVIDIA HGX H100 GPUs with NVLink connecting all GPUs.
The NVIDIA HGXTM H100 GPUs' heat is dissipated via a specialized closed-loop liquid-to-air heat exchanger that offers liquid cooling advantages of lower power consumption, quieter operation, and higher performance without requiring additional piping. Up to 6x SD665 V3 dual node trays can fit inside a single 6U ThinkSystem DW612S enclosure.
The enclosure houses up to 144 processors, 216 TB of DDR5 Memory, and up to 144x PCIe Gen5 x16 adapters on just two data center floor tiles with up to 6x chassis in a conventional 42U rack. Base Module Up to 4x double-wide, full-height, full-length; FHFL GPUs; PCIe Gen5 x16 Up to 8x 2.5” Hot Swap SAS/SATA/NVMe Dense Module Up to 8x double-wide, full-height, full-length GPUs each PCIe Gen5 x16 on PCIe switch Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs HGX Module NVIDIA HGXTM H100 4-GPU with 4x NVLink connected SXM5 GPUs Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
The NVIDIA HGXTM H100 GPUs' heat is dissipated via a specialized closed-loop liquid-to-air heat exchanger that offers liquid cooling advantages of lower power consumption, quieter operation, and higher performance without requiring additional piping. Up to 6x SD665 V3 dual node trays can fit inside a single 6U ThinkSystem DW612S enclosure.
The enclosure houses up to 144 processors, 216 TB of DDR5 Memory, and up to 144x PCIe Gen5 x16 adapters on just two data center floor tiles with up to 6x chassis in a conventional 42U rack. Base Module Up to 4x double-wide, full-height, full-length; FHFL GPUs; PCIe Gen5 x16 Up to 8x 2.5” Hot Swap SAS/SATA/NVMe Dense Module Up to 8x double-wide, full-height, full-length GPUs each PCIe Gen5 x16 on PCIe switch Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs HGX Module NVIDIA HGXTM H100 4-GPU with 4x NVLink connected SXM5 GPUs Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
Component
Specifications
Processors
Dual socket, 1x or 2x 4th Generation AMD EPYC processors per node, TDP up to 400W, Up to 96 cores / 192 threads
Memory
24x DDR5 DIMMs, 12 channels per CPU (1DPC), Maximum 3TB using 128GB RDIMMs, Up to 4800 MHz
Drive Bays (Per Module)
Base Module: Up to 8x 2.5” hot-swap SAS/SATA/NVMe
Dense Module: Up to 6x EDSFF E1.S NVMe SSDs or 4x EDSFF E3.S 1T NVMe HS SSDs
HGX Module: Up to 4x 2.5” hot-swap NVMe SSDs or 4x EDSFF E3.S 1T NVMe HS SSDs
Power Supplies
Four N+N redundant hot-swap PSUs (up to 2600W Titanium)
Cooling
Full ASHRAE A2 support with internal fans, Lenovo Neptune liquid-to-air hybrid cooling on NVIDIA HGX H100
Front Ports
SXM5 model, 4-DW GPU model, and 8-DW GPU model (rear I/O slots): 1x USB 3.1 G1 (5Gb/s), 1x USB 2.0 (XCC management), External diagnostics, VGA
8-DW GPU model (front I/O slots): No front ports
Rear Ports
3x USB 3.1 G1 (5Gb/s), 1x VGA, 1x RJ-45 1GbE (XCC management)
Models with rear I/O slots: Optional DB-9 COM serial port
Internal Ports
1x USB 3.1 G1 connector for OS or license key
Expansion Slots
Up to 6x PCIe Gen5 x16 adapters (2 front, 4 rear), 1x OCP NIC 3.0 (x16/x8/x4)
GPUs
SXM5 model: 4x SXM5 GPUs (@600W/GPU) with Lenovo Neptune cooling, 4x 2.5? drive bays or 4x EDSFF E3.S 1T NVMe SSDs
4-DW GPU model: 4x double-wide GPUs, 8x 2.5? drive bays
8-DW GPU model: 8x double-wide GPUs, 6x EDSFF E1.S NVMe SSDs or 4x EDSFF E3.S 1T NVMe SSDs
Dimensions
Height: 131 mm (5.2 in), Width: 448 mm (17.6 in), Depth: 892 mm (35.1 in)
Weight
SXM5 model: 39.5 kg (87 lb)
4-DW GPU model: 36.7 kg (81 lb)
8-DW GPU model: 39 kg (86 lb)
Management
Lenovo XClarity Controller
